This Article Full Text (PDF) References Alert me when this article is cited Alert me if a correction is posted Services Email this article to a friend Similar articles in this journal Alert me to new issues of the journal Add to Saved Citations Download to citation manager Request Permissions Request Reprints Add to My Marked Citations Citing Articles Citing Articles via Google Scholar Citing Articles via Scopus Google Scholar Articles by Belanger, B. Articles by Fisa, B. Search for Related Content Social Bookmarking                         What's this?

Injection Molding and Properties of Highly Filled Copper-Polyamide 11 Composites

B. Blanger

B. Sanschagrin

B. Fisa

Centre de Recherche Applique Sur Les Polymeres (CRASP), cole Polytechnique de Montral, Case Postale 6079, Succursale Centreville, Montreal (Qubec), Canada H3C 3A 7

Copper-polyamide-I1 composites containing up to 90 wt.% of spherical copper powder were made using three approaches: (1) conventional injection molding of dry copper-polyamide powder blends, (2) compounding of powder blends and subsequent injection molding of composite pellets, and (3) direct molding of powder blends on an injection machine equipped with a vacuum hopper. The conventional molding of powders results in products having a significant porosity, which originates from the air dragged into the machine with the powder. The other two approaches can be used to produce essentially void-free materials. The mechanical properties are affected by the state of the filler surface. The "as-atomized" copper (which has a rough surface covered with an oxide layer) adheres better to the polymer than that whose surface was reduced to pure metal by hydrogen.

Key Words: copper • polyamide 11 • composite • injection molding

Journal of Thermoplastic Composite Materials, Vol. 10, No. 6, 532-542 (1997)
DOI: 10.1177/089270579701000603


CiteULike    Complore    Connotea    Del.icio.us    Digg    Reddit    Technorati    Twitter    What's this?