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Selection of Critical Thermal/Structural Design Parameters for a Metal/Composite Joint in a Composite Electronics Enclosure

Johns Hopkins University, Applied Physics Laboratory, Laurel, MD 20723-6099; George Washington University, Dept. of Civil, Mech. and Environmental Eng., Washington, DC 20052

J. C. Roberts

Johns Hopkins University, Applied Physics Laboratory, Laurel, MD 20723-6099; Johns Hopkins University, Dept. of Mech. Eng., Baltimore, MD 21208

D. L. Jones

George Washington University, Dept. of Civil, Mech. and Environmental Eng., Washington, DC 20052

An experiment was designed to determine the critical design parameters for a metal/composite joint in a composite electronic enclosure where both thermal and mechanical performance are important. A combination bolted and bonded single-lap joint that simulates the interface between the thermal wall and the card guide was studied under static loading with power supplied through a surface-mounted chip resistor. The following parameters were varied: fiber orientation, type of thermally conductive pitch fiber, type of adhesive, adhesive thickness, bolt spacing, bolt size, and input power. Load, strain, and temperature from five thermocouples were collected during a tensile test with a 0.02 in/ min. strain rate. A fractional factorial experimental design was used. A dual failure mechanism was consistently recorded: failure of the adhesive bond followed by bolt shear failure. Initial screening results indicated that a configuration can be achieved that significantly enhances both mechanical and thermal performance.

Journal of Thermoplastic Composite Materials, Vol. 10, No. 4, 362-380 (1997)
DOI: 10.1177/089270579701000405


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